Fibercuit: Prototyping High-Resolution Flexible and Kirigami Circuits with a Fiber Laser Engraver

要旨

Prototyping compact devices with unique form factors often requires the PCB manufacturing process to be outsourced, which can be expensive and time-consuming. In this paper, we present Fibercuit, a set of rapid prototyping techniques to fabricate high-resolution, flexible circuits on-demand using a fiber laser engraver. We showcase techniques that can laser cut copper-based composites to form fine-pitch conductive traces, laser fold copper substrates that can form kirigami structures, and laser solder surface-mount electrical components using off-the-shelf soldering pastes. Combined with our software pipeline, an end user can design and fabricate flexible circuits which are dual-layer and three-dimensional, thereby exhibiting a wide range of form factors. We demonstrate Fibercuit by showcasing a set of examples, including a custom dice, flex cables, custom end-stop switches, electromagnetic coils, LED earrings and a circuit in the form of kirigami crane.

著者
Zeyu Yan
University Of Maryland, College Park, Maryland, United States
Anup Sathya
University of Maryland, College Park, Maryland, United States
Sahra Yusuf
George Mason University, Fairfax, Virginia, United States
Jyh-Ming Lien
George Mason University, Fairfax, Virginia, United States
Huaishu Peng
University of Maryland, College Park, Maryland, United States
論文URL

https://doi.org/10.1145/3526113.3545652

会議: UIST 2022

The ACM Symposium on User Interface Software and Technology

セッション: Fabrication

6 件の発表
2022-10-31 20:00:00
2022-10-31 21:30:00