Oh, Snap! A Fabrication Pipeline to Magnetically Connect Conventional and 3D-Printed Electronics

Abstract

3D printing has revolutionized rapid prototyping by speeding up the creation of custom-shaped objects. With the rise of multi-material 3Dprinters, these custom-shaped objects can now be made interactive in a single pass through passive conductive structures. However, connecting conventional electronics to these conductive structures often still requires time-consuming manual assembly involving many wires, soldering or gluing. To alleviate these shortcomings, we propose Oh, Snap!: a fabrication pipeline and interfacing concept to magnetically connect a 3D-printed object equipped with passive sensing structures to conventional sensing electronics. To this end, Oh, Snap! utilizes ferromagnetic and conductive 3D-printed structures, printable in a single pass on standard printers. We further present a proof-of-concept capacitive sensing board that enables easy and robust magnetic assembly to quickly create interactive 3D-printed objects. We evaluate Oh, Snap! by assessing the robustness and quality of the connection and demonstrate its broad applicability by a series of example applications.

Award
Best Paper
Authors
Martin Schmitz
Technical University of Darmstadt, Darmstadt, Germany
Jan Riemann
Technical University of Darmstadt, Darmstadt, Germany
Florian Müller
TU Darmstadt, Darmstadt, Germany
Steffen Kreis
TU Darmstadt, Darmstadt, Germany
Max Mühlhäuser
TU Darmstadt, Darmstadt, Germany
DOI

10.1145/3411764.3445641

Paper URL

https://doi.org/10.1145/3411764.3445641

Video

Conference: CHI 2021

The ACM CHI Conference on Human Factors in Computing Systems (https://chi2021.acm.org/)

Session: Engineering Real-World Interaction

[A] Paper Room 05, 2021-05-11 17:00:00~2021-05-11 19:00:00 / [B] Paper Room 05, 2021-05-12 01:00:00~2021-05-12 03:00:00 / [C] Paper Room 05, 2021-05-12 09:00:00~2021-05-12 11:00:00
Paper Room 05
13 items in this session
2021-05-11 08:00:00
2021-05-11 10:00:00
Japanese summary
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