Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending


Fabricating 3D printed electronics using desktop printers has become more accessible with recent developments in conductive thermoplastic filaments. Because of their high resistance and difficulties in printing traces in vertical directions, most applications are restricted to capacitive sensing. In this paper, we introduce Thermoformed Circuit Board (TCB), a novel approach that employs the thermoformability of the 3D printed plastics to construct various double-sided, rigid and highly conductive freeform circuit boards that can withstand high current applications through copper electroplating. To illustrate the capability of the TCB, we showcase a range of examples with various shapes, electrical characteristics and interaction mechanisms. We also demonstrate a new design tool extension to an existing CAD environment that allows users to parametrically draw the substrate and conductive trace, and export 3D printable files. TCB is an inexpensive and highly accessible fabrication technique intended to broaden HCI researcher participation.

Freddie Hong
Imperial College London, London, United Kingdom
Connor Myant
Imperial College London, London, United Kingdom
David E. Boyle
Imperial College London, London, United Kingdom




会議: CHI 2021

The ACM CHI Conference on Human Factors in Computing Systems (

セッション: Fabrication

[A] Paper Room 08, 2021-05-12 17:00:00~2021-05-12 19:00:00 / [B] Paper Room 08, 2021-05-13 01:00:00~2021-05-13 03:00:00 / [C] Paper Room 08, 2021-05-13 09:00:00~2021-05-13 11:00:00
Paper Room 08
12 件の発表
2021-05-12 17:00:00
2021-05-12 19:00:00