Assembler^3: 3D Reconstruction of Laser-cut Models

要旨

We present assembler^3 a software tool that allows users to perform 3D parametric manipulations on 2D laser cutting plans. Assembler^3 achieves this by semi-automatically converting 2D laser cutting plans to 3D, where users modify their models using available 3D tools (kyub), before converting them back to 2D. In our user study, this workflow allowed users to modify models 10x faster than using the traditional approach of editing 2D cutting plans directly. Assembler^3 converts models to 3D in 5 steps: (1) plate detection, (2) joint detection, (3) material thickness detection, (4) joint matching based on hashed joint "signatures", and (5) interactive reconstruction. In our technical evaluation, assembler^3 was able to reconstruct 100 of 105 models. Once 3D-reconstructed, we expect users to store and share their models in 3D, which can simplify collaboration and thereby empower the laser cutting community to create models of higher complexity.

著者
Thijs Roumen
Hasso Plattner Institute, Potsdam, Germany
Yannis Kommana
Hasso Plattner Institute, Potsdam, Germany
Ingo Apel
Hasso Plattner Institute, Potsdam, Germany
Conrad Lempert
Hasso Plattner Institute, Potsdam, Germany
Markus Brand
Hasso Plattner Institute, Potsdam, Germany
Erik Brendel
Hasso Plattner Institute, Potsdam, Germany
Laurenz Seidel
Hasso Plattner Institute, Potsdam, Germany
Lukas Rambold
Hasso Plattner Institute, Potsdam, Germany
Carl Goedecken
Hasso Plattner Institute, Potsdam, Germany
Pascal Crenzin
Hasso Plattner Institute, Potsdam, Germany
Ben Hurdelhey
Hasso Plattner Institute, Potsdam, Germany
Muhammad Abdullah
Hasso Plattner Institute, Potsdam, Germany
Patrick Baudisch
Hasso Plattner Institute, Potsdam, Germany
DOI

10.1145/3411764.3445453

論文URL

https://doi.org/10.1145/3411764.3445453

動画

会議: CHI 2021

The ACM CHI Conference on Human Factors in Computing Systems (https://chi2021.acm.org/)

セッション: Fabrication

[A] Paper Room 08, 2021-05-12 17:00:00~2021-05-12 19:00:00 / [B] Paper Room 08, 2021-05-13 01:00:00~2021-05-13 03:00:00 / [C] Paper Room 08, 2021-05-13 09:00:00~2021-05-13 11:00:00
Paper Room 08
12 件の発表
2021-05-12 17:00:00
2021-05-12 19:00:00
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